TRANSEPIC Introduces High Accuracy TSG8200 Battery Management Gauge
Battery management gauge chip with high precision, low power consumption and adaptable to most battery cells. lt can be widely used in various battery packs and battery power supply systems. It provide a total gauge estimate solution for high-precision measurement of battery SOC SOH management.
This operational amplifier chip is a linear type Op Amp with ultra-low offset voltage, ultra-low input current and low-power consumption. lt is widely used in various electronic devices, including audio and video processing, power measurement and protection, and sensor signal processing. lts high precision, low noise,wide bandwidth and fast respond can better meet the needs of various practical applications.
Transepic Semiconductor is a fabless digital-analog mixed-signal chain IC design company founded in February 2021, headquartered in Chengdu with a subsidiary in Shanghai. We specialize in R&D and design of high-performance digital-analog mixed-signal semi
We deliver the most innovative, high-performance analog chips and solutions
We emphasize engineering culture, with a mindset of results oriented and innovation-driven.
We encourage diversity, with an international culture and local compatibility.
More than 10 years of experience in chip R&D and mass production
Our team has a wealth of technical expertise, bringing together graduates from top universities around the world, including Tsinghua University, Delft University of Technology, and MIT, as well as a group of senior engineers who have accumulated extensive experience all over the world. Our core technical staff has over 10 years of experience in chip design, bringing chips to mass production, architecture design and program management. They have held key positions in well-known companies in the semiconductor industry such as Apple, NXP, Maxis, Huawei, TI, and Ziguang, providing us with a wealth of expertise and technical support.
Cumulative publications Semiconductor Top Magazine
Team Design Number of Chips in Mass Production
The team has cumulatively published Number of ISSCC papers